Date: December 11th, 2008
Article by: Nathan Glentworth (Owner / Head Editor)
Product was submitted by: Intel
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PRODUCT SPECIFICATIONS & FEATURES (From Intel)
Detailed white papers on the new Nehalem processor technology can be found HERE and HERE.
Basic Processor Specs
Die Size: 263 square millimeters
Transistor Count: 731 Million
Thermal Output: 130Watts
L1 D-Cache: 32kBytes x 4
L1 I-Cache: 32kBytes x 4
L2 Cache: 256kBytes x 4
L3 Cache: 8Mbytes x 1
Instruction Set Suporrt: SSE1-4, SSE4.1, 4.2 and 64bit
Next-Generation Intel® Microarchitecture
Intel's next-generation microarchitecture (codenamed "Nehalem") represents the next step in processor energy efficiency, performance, and dynamic scalability. Designed from the ground up to take advantage of hafnium-based Intel® 45nm hi-k metal gate silicon technology, Nehalem will also be the first to introduce Intel® QuickPath technology.
Now performance really does come "on-demand"
We've expanded and redefined what's possible for technologies to come:
Dynamic scalability , managed cores, threads, cache, interfaces, and power for energy-efficient performance on demand.
Design and performance scalability for server, workstation, PC, and mobile demands with support for 2-8+ cores and up to 16+ threads with simultaneous multi-threading (SMT), and scalable cache sizes, system interconnects, and integrated memory controllers.
Simultaneous multi-threading brings high-performance applications into mainstream computing with 1-16+ threads optimized for a new generation multi-core processor architecture.
Scalable shared memory of Intel QuickPath technology features memory distributed to each processor with integrated memory controllers and high-speed point-to-point interconnects to unleash the performance of next-generation Intel® multi-core processors.
Multi-level shared cache improves performance and efficiency by reducing latency to frequently used data.
Intel ® QuickPath Technology
Unleashing performance with interconnect system architecture
Providing point-to-point high-speed links to distributed shared memory, Intel® QuickPath technology unleashes the parallel processing performance of next-generation Intel® 45nm microarchitectures (codenamed Nehalem and Tukwila). These microarchitectures, built from the ground up, will be the first to use the Intel QuickPath interconnect system and can see significant improvements in overall performance.
With new Intel QuickPath technology built into future Nehalem and Tukwila microarchitectures, each processor core will feature an integrated memory controller and high-speed interconnect, linking processors and other components to deliver:
Dynamically scalable interconnect bandwidth designed to set loose the full performance of Nehalem, Tukwila, and future generations of Intel® multi-core processors
Outstanding memory performance and flexibility to support leading memory technologies
Tightly integrated interconnect reliability, availability, and serviceability (RAS) with design-scalable configurations for optimal balance of price, performance, and energy efficiency
Intel Nehalem and Tukwila microarchitecture featuring Intel QuickPath technology will be available in 2008.