Date: November 3rd, 2010
Article by: Joe Anderson (Hardware Reviewer)
Edited By: Nathan Glentworth (Owner / Head Editor)
Product was submitted by: In Win
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PRODUCT SPECIFICATIONS AND FEATURES
Basically, the Android is a steel mid-tower ATX chassis featuring nine drive bays and four large cooling fans. Like the other cases in the series, the end user can add fans to customize the cooling to suit the application, and dust control is also provided. The Android also comes with some tool-free features that we'll examine as we proceed with the review.
PRODUCT COMPOSITION
In Win ships the Android in a sturdy cardboard carton featuring full color images of the case along with complete specification and features lists.
Inside, the Android is packaged in a plastic bag sandwiched between two foam blocks. While this is more than adequate, it's also unremarkable and the chassis arrived in pristine condition after its long trip across the country. I'm eager to see what In Win's new Android case brings to the table.
Along with the user's guide, In Win supplies an extra expansion slot cover, a wire management clip with adhesive backing, a padlock loop, a speaker, one 3-pin to 4-pin Molex adapter and a bag of assorted screws and mobo standoffs.
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