Date: October 9th, 2008
Article by: Nathan Glentworth (Owner / Head Editor)
Product was submitted by: Gelid
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PRODUCT SPECIFICATIONS
| INCLUDED: |
Applicator |
| Net Content (g): |
5 |
| Specific Gravity (g/cm3): |
3.96 |
| Viscosity (Poise): |
2850 |
A High Performance Thermal Compound
Created for today's high power CPU's, graphic processors and other semi conductors GELID's GC-1 provides both silent and gaming enthusiasts with top level performance, system stability and easy application at a better price than most other high high performance compounds.
Superior Performance & High Thermal Conductivity
GC-1 is a compound made of advanced silicone fluid and thermally conductive nano-filler particles. High performance is achieved within a very short time.
Stability
Consistent performance over approximately 10 years. The compound does not need to be reapplied nor is there any decrease in performance over time.
Ease of Application
The syringe is very user friendly and the applicator makes application onto the heatsink or CPU child's play.
Completely Safe
Unlike other compounds GELID's GC-1 is non electrical conductive and does not contain any metal particles. This eliminates any risk of short-circuits.
RoHS Compliant
Net Weight: 5g (25% for FREE)
MSRP: USD 6.99/ Euro 4.70
PRODUCT COMPOSITION AND WALKTHROUGH
With an introductory MSRP of $6.99 for 5 grams, Gelid's GC-1 compound isn't exactly trying to undercut the competition directly, but they do want to offer more product for a comparable price.
Seeing this a simple product, there isn't a whole lot to go through other than the thermal compound itself and an interesting addition. Gelid chose to include a compound applicator to make the job even easier. Gone are the days of spreading thermal paste with an old business or credit card you have kicking around your computer room. This applicator does indeed make the job easier and I think Gelid broke some new ground by including it.
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