Date: September 19th, 2007
Article by: Joe Anderson (Hardware Reviewer)
Edited by: Nathan Glentworth (Owner / Head Editor)
Product was submitted by: Ai Technology
<--CLICK FOR DEALS ON THERMAL COMPOUND IN THE UNITED STATES
<--CLICK FOR DEALS ON THERMAL COMPOUND IN CANADA
AI TECHNOLOGY COOL SILVER INTRODUCTION
If you spend much time in online computer forums, I'm sure you've read it many, many times. “Which thermal paste is best?” For the last several years a couple of products by a single manufacturer seem to always top the list. Lately, the thermal paste wars are really heating up with several new products entering the fray. We've tested most of them here at Tweaknews, and the results were really too close to declare a clear winner. AI Technologies recently sent us a sample of their new Cool Silver thermal product for evaluation. They tout it as “The best in thermal management,” and “The ultimate weapon against CPU meltdown.” Will this be the product that finally bests the reigning champ? Follow along as we find out.
AI TECHNOLOGY CORPORATE PROFILE
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced material and adhesive solution for electronic interconnection and packaging. The company has a ISO9001:2000 certified manufacturing and R&D facility in the U.S. and a Far East Service Center in Hong Kong. The headquarters has more than 50,000 square feet within a 16-acre campus in Princeton Junction, NJ.
AI Technology manufactures various forms of high performance flexible “Stress-free” adhesive films and pastes and materials for microelectronic packaging and thermal management applications. Our newest research has yielded higher performance and lower cost, solderable flexible circuit substrate material to replace polyimide in high frequency, RFID, and replaceing PTFE substrate material in microwave circuits. Our technology and products include solvent-free die attach pastes and films, compressible gap-filling phase change thermal interface pads, polymer based Solder-Sub ® BGA, near-hermetic lid sealant, EMI Shielding materials, double-sided UV-release wafer griding tapes, and high temperature-static free dicing tapes.